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Wafer non-contact tweezers Product List

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Non-contact tweezers for high-temperature wafers

Non-contact tweezers for high-temperature wafers

Heat-resistant tweezers for non-contact removal of wafers from a high-temperature susceptor.

A "non-contact tweezers" designed for high-temperature operation that allows for the non-contact removal of wafers from a hot susceptor after epitaxial film deposition on semiconductor wafers using a CVD apparatus. It features a handle equipped with a manual valve, enabling gas supply ON-OFF control through valve operation with a hand holding the handle, similar to using tweezers, while the wafers are suspended and transported by a "float chuck" that holds them non-contact by ejecting gas.

  • CVD Equipment
  • Other machine elements
  • Laser marker

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Non-contact tweezers for 300mm high refractive index glass wafers

Non-contact tweezers for 300mm high refractive index glass wafers

Non-contact tweezers for 300mm high refractive index glass wafers

Transfer and handle the φ300mm high refractive index glass wafer non-contact using tweezers through manual operation, without bending, applying stress, or causing scratches and dirt.

  • Other semiconductor manufacturing equipment
  • Wafer
  • Wafer processing/polishing equipment

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Non-contact tweezers for protoss carriers

Non-contact tweezers for protoss carriers

Non-contact tweezers for transferring wafers for protoss carriers without damaging them.

The non-contact tweezers for proto carriers remove or store thin wafers and warped wafers from or to the proto carrier without contact.

  • Other conveying machines
  • Semiconductor inspection/test equipment
  • Pneumatic Equipment

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Non-contact tweezers for compound semiconductor wafers

Non-contact tweezers for compound semiconductor wafers

The compound semiconductor wafers (GaAs, InP, GaP) are transported to a designated position non-contactly through manual operation.

◎Features 1. Non-contact transport of high-temperature wafers at 450°C is possible. 2. Non-contact transport of the following notched compound semiconductor wafers (GaAs, InP, GaP) is possible: - Φ2 to 4 inch wafers - Φ2 to 4 inch x 1/4 wafers - Φ2 to 4 inch x 1/2 wafers

  • CVD Equipment
  • Plasma surface treatment equipment
  • Heating device

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